UV-Releasing Dicing Tape
By A Mystery Man Writer
Description
High Power 6'' 8'' 12'' UV Wafer Tape Curing Systems Curing Semiconductor
Semiconductor UV Tape Dicing & Grinding Prevent chip flying during dicing due to the excellent adhesion Easily removed after UV irradiation BG Tape Back Grinding Wafer surface protection during grinding Mold Release
Wafer Dicing Tapes - AI Technology, Inc.
AMC > Semiconductor tape > Type of semiconductor tape > Dicing Adhesive Tape
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per adult (price varies by group size)